| 制造商 | 部件名 | 数据表 | 功能描述 |
 Samsung semiconductor |
KS57P2316
|
49Kb / 4P |
BONDING DIAGRAM
|
 Tyco Electronics |
33461
|
662Kb / 60P |
SOLISTRAND, Budget and DIAMOND GRIP
|
 List of Unclassifed Man... |
1344171
|
93Kb / 2P |
Shielding and Bonding Cable.
|
|
1345387
|
93Kb / 2P |
Shielding and Bonding Cable.
|
|
1351630
|
92Kb / 2P |
Shielding and Bonding Cable.
|
|
1351692
|
93Kb / 2P |
Shielding and Bonding Cable
|
 Central Semiconductor C... |
CBR1F
|
664Kb / 3P |
Inventory bonding
|
 3M Electronics |
08641
|
19Kb / 4P |
Automix??Channel Bonding and Sidelite Adhesive
|
 IDEAL-TEK SA |
2.SA.DC.0
|
523Kb / 1P |
High Precision - Diamond Tip Tweezers
|
|
2A.SA.DC.0
|
522Kb / 1P |
High Precision - Diamond Tip Tweezers
|