08CP08-M4ETC32 pdf, 08CP08-M4ETC32 功能描述, 08CP08-M4ETC32 数据表, 08CP08-M4ETC32 view ::: ALLDATASHEET :::

部件名	08CP08-M4ETC32

功能描述	Embedded Package-on-Package Memory for Wearables

文件大小	2521.96 Kbytes

Html View	1 2

制造商	KINGSTON [Kingston Technology Far East Co. Ltd]

网页	https://www.kingston.com/

标志

类似零件编号 - 08CP08-M4ETC32

制造商	部件名	数据表	功能描述
Samsung semiconductor	KAB01D100M	1Mb / 72P	Multi-Chip Package MEMORY
fujitsu semiconductor	MB81ES653225-12	485Kb / 10P	Consumer/Embedded Application Specific Memory for SiP
Intel Corporation	28F640P3	1Mb / 102P	Intel StrataFlash Embedded Memory
Infineon Technologies A...	PLF2224	499Kb / 2P	24 2G Switch on a Chip with Embedded Memory
Amkor Technology	PSVFBGA	251Kb / 2P	Package on Package (PoP) Family
Analog Devices	ADSP-BF523C	2Mb / 44P	Blackfin Embedded Processor 289-ball MBGA package Rev. PrC
SPANSION	S34ML01G1	2Mb / 73P	Spansion짰 SLC NAND Flash Memory for Embedded
Micron Technology	MT29C4G48MAZAPAKD-5IT	428Kb / 15P	NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP?? MT29C Family
OSRAM GmbH	CHDELSS1.22	677Kb / 22P	Wearables
HK TO-GRACE TECHNOLOGY ...	LTW-020ZDCG-E2	681Kb / 11P	Package in 12mm tape on 7