| 制造商 | 部件名 | 数据表 | 功能描述 |
 American Electronic Com... |
DA30-P736
|
327Kb / 2P |
compact form factor
|
 Laird Tech Smart Techno... |
LA-075-24-02-00-00
|
264Kb / 3P |
Compact form factor
|
|
LA-024-12-02-00-00
|
262Kb / 3P |
Compact form factor
|
|
LA-160-24-02-00-00
|
307Kb / 3P |
Compact form factor
|
|
DL-210-24-00-00-00
|
241Kb / 3P |
Compact form factor
|
 Vishay Siliconix |
VS-90-110MT.KPBF
|
220Kb / 8P |
High thermal conductivity package, electrically insulated case
03-Mar-14 |
 AVAGO TECHNOLOGIES LIMI... |
ALMD-EL3E
|
655Kb / 12P |
Compact form factor
|
|
ALMD-EL3D
|
1Mb / 14P |
Compact form factor
|
 Vishay Siliconix |
VS-GBPC
|
153Kb / 7P |
High thermal conductivity package, electrically insulated case
27-May-15 |
 ams AG |
GWJDSTS2.CM
|
2Mb / 26P |
Introducing the new Generation-2 DURIS® E 5 which combines higher efficacy and higher flux in a compact industry-compatible form factor (5.6 mm x 3.0 mm).
Version 1.5 2023-03-09 |