| 制造商 | 部件名 | 数据表 | 功能描述 |
 Maxim Integrated Produc... |
21-0144B
|
135Kb / 2P |
PACKAGE OUTLINE
Rev B |
 SMSC Corporation |
8SOIC
|
295Kb / 1P |
8 PIN SOIC PACKAGE OUTLINE
|
 Zetex Semiconductors |
SC70-5
|
195Kb / 3P |
Surface mounted, 5 pin package Package outline
|
|
MLP322
|
176Kb / 3P |
Surface mounted, 3 pin package Package outline
|
|
SOD523
|
177Kb / 3P |
Surface mounted, 2 pin package Package outline
|
 Global Mixed-mode Techn... |
DFN2X2-10
|
195Kb / 1P |
Package Outline
|
|
HTSSOP-14
|
126Kb / 1P |
Package Outline
|
|
MSOP-10
|
180Kb / 1P |
Package Outline
|
 Wall Industries,Inc. |
NED
|
415Kb / 6P |
Through Hole Package
|
 Allied Components Inter... |
AETD34-3643
|
3Mb / 1P |
ETD34, 12 Pin Through Hole Package
|