| 制造商 | 部件名 | 数据表 | 功能描述 |
 PIC GmbH |
MS-106-3
|
23Kb / 1P |
Miniature Reed Sensor - pitch 15.24 mm
|
 Aries Electronics, Inc. |
44-647-10
|
842Kb / 1P |
Universal SOIC-to-DIP 0.600 [15.24] Adapter
|
|
32-655000-10
|
676Kb / 1P |
TSOP-to-DIP 0.600 [15.24] Adapter
|
 DB Lectro Inc |
MS-106-3
|
23Kb / 1P |
Miniature Reed Sensor ??pitch 15.24 mm
|
 EPCOS |
B82479A1
|
541Kb / 7P |
SMT power inductors Size 18.54 x 15.24 x 7.11 (mm) Winding: enamel copper wire
|
 Aries Electronics, Inc. |
10016
|
880Kb / 1P |
SOIC-to-DIP 0.600 [15.24] Adapter
|
|
18041
|
746Kb / 1P |
Series 655000 TSOP-to-DIP 0.600 15.24 Adapter
|
 Lumberg |
AZ30
|
311Kb / 3P |
Micromodul connectors, pitch 1.27 mm
|
|
MICAL
|
738Kb / 3P |
Micromodul connectors, pitch 1.27 mm
|
 Samtec, Inc |
SFC
|
324Kb / 1P |
(1.27 mm) .050
|