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0879202003 数据表 (PDF) - Molex Electronics Ltd.

部件名	0879202003

功能描述	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 20 Circuits, Tin (Sn) Overall Plating, with Pick-and-Place Cap, without Peg

文件大小	1427.77 Kbytes

Html View	1 2 3 4 5 6 7 8 9 Next

制造商	MOLEX10 [Molex Electronics Ltd.]

网页	http://www.molex.com

标志

0879202003 数据表 (PDF) - Molex Electronics Ltd.

类似零件编号 - 0879202003

制造商	部件名	数据表	功能描述
Molex Electronics Ltd.	0879200014	1Mb / 13P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, Tin (Sn) Overall Plating, with Pick-and-Place Cap
	0879200830	1Mb / 12P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap
	0879200833	1Mb / 16P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap, without Peg
	0879208115	1Mb / 13P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, with Pick-and-Place Cap, with Peg, Tape and Reel
	0879208147	1Mb / 13P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, with Pick-and-Place Cap, with Peg, Tube Packaging

类似说明 - 0879202003

制造商	部件名	数据表	功能描述
Molex Electronics Ltd.	0015800201	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
	0015800207	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
	0015912200	1Mb / 8P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 20 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
	0879200830	1Mb / 12P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap
	0879209311	1Mb / 13P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Overall Plating, with Cap, without Peg, Tape on Reel Packaging, Lead-free
	0879200833	1Mb / 16P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap, without Peg
	0879208115	1Mb / 13P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, with Pick-and-Place Cap, with Peg, Tape and Reel
	0879209346	1Mb / 13P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 34 Circuits, Tin (Sn) Overall Plating, without Cap, without Peg, Tube Packaging, Lead-free
	0879200014	1Mb / 13P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, Tin (Sn) Overall Plating, with Pick-and-Place Cap
	15-91-2200	35Kb / 2P	2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 20 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

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