| 制造商 | 部件名 | 数据表 | 功能描述 |
 Fairchild Semiconductor |
FM2G200US60
|
701Kb / 9P |
Molding Type Module
|
|
FM2G300US60
|
696Kb / 9P |
Molding Type Module
|
|
FMG1G50US60H
|
627Kb / 9P |
Molding Type Module
|
|
FMG1G75US60L
|
656Kb / 9P |
Molding Type Module
|
|
FMG2G300US60E
|
721Kb / 7P |
Molding Type Module
|
|
FMG2G300US60
|
553Kb / 7P |
Molding Type Module
|
|
FM2G75US60
|
711Kb / 9P |
Molding Type Module
|
|
FM2G50US60
|
703Kb / 9P |
Molding Type Module
|
 Sumida Corporation |
CDMC80D50AA
|
221Kb / 4P |
Metal compound molding type construction
|
 Ohmite Mfg. Co. |
RES-WH-WN
|
305Kb / 2P |
Encapsulated by epoxy molding compound
|