| 制造商 | 部件名 | 数据表 | 功能描述 |
 Toshiba Semiconductor |
TLP3904
|
241Kb / 7P |
a small outline coupler, suitable for surface mount assembly
|
|
TLP3213
|
248Kb / 7P |
a super small-outline photorelay, suitable for surface-mount assembly
|
 M/A-COM Technology Solu... |
ANI-019
|
588Kb / 6P |
Tape & Reel Packaging and Orientation for Surface Mount Components
|
|
M513
|
496Kb / 28P |
Tape and Reel Packaging for Surface Mount Components
|
 Bourns Electronic Solut... |
MF-MSMF150-2
|
319Kb / 5P |
Surface mount packaging for automated assembly
|
|
MF-MSMF260-2
|
319Kb / 5P |
Surface mount packaging for automated assembly
|
 M/A-COM Technology Solu... |
ANI-019
|
288Kb / 7P |
Tape & Reel Packaging and Orientation for Surface Mount Components
|
 Vanlong Technology Co.,... |
MD-MP
|
52Kb / 1P |
Suitable for surface mount and reflow soldering
|
 Delta Electronics, Inc. |
DNS10SMD06
|
794Kb / 15P |
Surface mount packaging
|
 EHAOAN. |
EH-2835S850-20120
|
2Mb / 9P |
Suitable for SMT assembly
|