| 制造商 | 部件名 | 数据表 | 功能描述 |
 STMicroelectronics |
SSOP24
|
59Kb / 4P |
24-LEAD SHRINK SMALL OUTLINE PACKAGE
Nov-2002 |
 Toshiba Semiconductor |
TLP706F
|
133Kb / 2P |
Intelligent power module signal isolation
|
|
TLP702F
|
94Kb / 2P |
Intelligent power module signal isolation
|
 STMicroelectronics |
SO-8
|
56Kb / 5P |
8-LEAD SMALL OUTLINE PACKAGE
Feb-2005 |
|
POWERSO-10
|
85Kb / 5P |
10LEADS POWER SMALL OUTLINE PACKAGE
Nov-2002 |
 AVAGO TECHNOLOGIES LIMI... |
HCPL-M456
|
197Kb / 14P |
Small Outline, 5 Lead Intelligent Power Module Optocoupler
|
|
ACPL-782T-000E
|
257Kb / 18P |
Automotive Isolation Amplifier with R2Coupler??Isolation
|
|
ACPL-782T-300E
|
257Kb / 18P |
Automotive Isolation Amplifier with R2Coupler Isolation
|
 Advanced Power Electron... |
AP2306AGEN-HF
|
101Kb / 4P |
Small Outline Package
|
 Amkor Technology |
POWERSOP
|
311Kb / 2P |
Power Small Outline Package,PowerSOP
|