| 制造商 | 部件名 | 数据表 | 功能描述 |
 NXP Semiconductors |
SOT117-1
|
9Kb / 1P |
DIP28: plastic dual in-line package; 28 leads (600 mil)
2003 Feb 18 |
 Continental Device Indi... |
WOM
|
57Kb / 3P |
WOM 4-Leads Leaded Plastic Package
|
|
TO-92L
|
320Kb / 5P |
TO-92L (3 Leads) Leaded Plastic Package
|
|
KBPC-W
|
166Kb / 4P |
KBPC-W and MP-W (4 Leads) Square Leaded Package
|
|
KBPC-8
|
107Kb / 3P |
KBPC-8 (4 Leads) Square Leaded Package
|
|
KBPC
|
148Kb / 3P |
KBPC (4 Leads) Square Leaded Package
|
|
KBP4
|
122Kb / 3P |
KBP 4 Leads (In-line) Leaded Package
|
|
KBL
|
149Kb / 3P |
KBL (4 Leads) In-line Leaded Package
|
|
GBU
|
328Kb / 3P |
GBU (4 Leads) In-line Leaded Plastic Package
|
|
GBJ4
|
80Kb / 3P |
GBJ 4 Leads (In-line) Leaded Package
|