| 制造商 | 部件名 | 数据表 | 功能描述 |
 Aavid, Thermal Division... |
573400D00010
|
92Kb / 2P |
For use with Surface Mount packages
2/25/2003 |
 NXP Semiconductors |
AN10778
|
280Kb / 14P |
PCB layout guidelines for NXP MCUs in BGA packages
Rev. 2-15 April 2011 |
 ACCUTEK MICROCIRCUIT CO... |
AK04D300-XTAL-04CLCC
|
193Kb / 3P |
Crystal Oscillators in Surface Mount Packages
|
 AVAGO TECHNOLOGIES LIMI... |
HSMP-3863-TR1G
|
356Kb / 10P |
Unique Configurations in Surface Mount Packages
|
|
HSMP-3864-BLKG
|
273Kb / 10P |
Unique Configurations in Surface Mount Packages
|
|
HSMP-389T-BLKG
|
332Kb / 13P |
Unique Configurations in Surface Mount Packages
|
 STMicroelectronics |
AN4211
|
796Kb / 13P |
Guidelines for soldering MEMS microphones
08-Aug-2014 |
|
TN0018
|
224Kb / 9P |
Surface mounting guidelines for MEMS sensors
24-Mar-2014 |
|
AN1703
|
782Kb / 22P |
GUIDELINES FOR USING ST?셎 MOSFET SMD PACKAGES
Jun-2003 |
|
AN4312
|
978Kb / 36P |
Guidelines for designing touch sensing applications with surface sensors
30-Sep-2013 |