| 制造商 | 部件名 | 数据表 | 功能描述 |
CTS Corporation |
HP3
|
430Kb / 6P |
METAL CASE, CASE-MOUNTED SEMICONDUCTORS
|
|
LA-A1
|
87Kb / 2P |
METAL CASE, CASE-MOUNTED SEMICONDUCTORS
|
jb Capacitors Company |
JFD
|
344Kb / 2P |
Non-inductive, plastic case and epoxy resin
|
|
JFV
|
494Kb / 7P |
Non-inductive, (UL940V-0) plastic case sealed with epoxy resin
|
|
JFN
|
208Kb / 2P |
Non-inductive, (UL940V-0) plastic case sealed with epoxy resin
|
|
JFO
|
176Kb / 1P |
Non-inductive, (UL940V-0) plastic case sealed with epoxy resin
|
|
JFZ
|
365Kb / 3P |
Non-inductive, (UL940V-0) plastic case sealed with epoxy resin
|
Suntan Capacitors |
TS08V
|
124Kb / 1P |
NON ??INDUCTIVE, (UL940V-0) PLASTIC CASE SEALED WITH EPOXY RESIN
|
PHOENIX CONTACT |
1229456
|
45Kb / 1P |
Case - THERMOMARK GO CASE
|
|
0803675
|
51Kb / 2P |
Case - TMP CASE
09/11/2020 |
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