21-0117G pdf, 21-0117G 功能描述, 21-0117G 数据表, 21-0117G view ::: ALLDATASHEET :::

部件名	21-0117G

功能描述	PACKAGE OUTLINE, 2x2 UCSP

文件大小	57.99 Kbytes

Html View	1

制造商	DALLAS [Dallas Semiconductor]

网页	https://www.maximintegrated.com/en.html

标志

类似零件编号 - 21-0117G

制造商	部件名	数据表	功能描述
Dallas Semiconductor	21-0110	55Kb / 2P	PACKAGE OUTLINE, 32L TQFP, 5x5x1.0mm
Maxim Integrated Produc...	21-0111	31Kb / 1P	PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD Rev E
	21-0114	58Kb / 1P	PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE) REV B
	21-0114B	58Kb / 1P	PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE) REV B

制造商	部件名	数据表	功能描述
Maxim Integrated Produc...	21-0144B	135Kb / 2P	PACKAGE OUTLINE Rev B
	21-0093	38Kb / 1P	PACKAGE OUTLINE, 9 BUMPS, 3*3 ARRAY, UCSP(B)PKG. Rev M
	21-0104	40Kb / 1P	PACKAGE OUTLINE, 12BUMPS, 3*4ARRAY, UCSP(B)PKG. Rev G
Global Mixed-mode Techn...	DFN2X2-10	195Kb / 1P	Package Outline
	HTSSOP-14	126Kb / 1P	Package Outline
	MSOP-10	180Kb / 1P	Package Outline
	QFN5X5-20	127Kb / 1P	Package Outline
	QFN5X5-40	128Kb / 1P	Package Outline
	QFN6X6-40	140Kb / 1P	Package Outline
	SOP-8-EP	187Kb / 1P	Package Outline