| 制造商 | 部件名 | 数据表 | 功能描述 |
 Hirose Electric |
HP5-189P-1.27W
|
1Mb / 34P |
High-density Packaging System
|
|
PO55-P-316
|
259Kb / 6P |
High-density Packaging System(Coaxial Connectors for Hi-PAS Mounting)
|
 Omron Electronics LLC |
B3S-1000P
|
230Kb / 4P |
Surface Mount Tactile Switch for High-Density Packaging
|
 List of Unclassifed Man... |
1619-1
|
493Kb / 1P |
Space saving design for high density packaging
|
 CTS Corporation |
752161102G
|
233Kb / 4P |
High Density Packaging
|
|
753081103GP
|
189Kb / 4P |
High Density Packaging
|
|
753
|
189Kb / 4P |
High Density Packaging
|
 Raltron Electronics Cor... |
RT3215
|
133Kb / 1P |
IDEAL FOR HIGH DENSITY PACKAGING APPLICATION
|
 Shanghai Leiditech Elec... |
BZT52C3V3
|
895Kb / 3P |
Small package size suitable for high-density applications
|
|
BZT52C62
|
895Kb / 3P |
Small package size suitable for high-density applications
|