STPS1150 datasheet(4/6 Pages) STMICROELECTRONICS

4 / 6 page

STPS1150

4/6

Figure 11:

Forward

voltage

drop

versus

forward current (maximum values, high level)

Figure

12: Forward

voltage drop versus

forward current (maximum values, low level)

Figure 13: Thermal resistance junction to

ambient versus copper surface under each

lead (Epoxy printed circuit board FR4, copper

thickness: 35µm) (SMA)

Figure 14: Thermal resistance versus lead

length (DO-41)

(A)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

(V)

T =125°C

(maximum values)

T =125°C

(typical values)

T =25°C

(maximum values)

(A)

100

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

(V)

T =25°C

(maximum values)

T =125°C

(maximum values)

T =125°C

(typical values)

(°C/W)

th(j-a)

100

110

120

130

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S(cm²)

R (°C/W)

100

120

10152025

(mm)

leads

Rth(j-I)

Rth(j-a)

STPS1150 数据表(PDF) 4 Page - STMicroelectronics

STPS1150 数据表(HTML) 4 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6

数据表下载

链接网址

STPS1150 数据表(PDF) 4 Page - STMicroelectronics

STPS1150 数据表(HTML) 4 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6

数据表 下载

链接网址

数据表下载