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VNH2SP30 数据表(PDF) 19 Page - STMicroelectronics |
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VNH2SP30 数据表(HTML) 19 Page - STMicroelectronics |
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19 / 26 page ![]() 19/26 VNH2SP30-E MultiPowerSO-30™ Thermal Data Figure 38. MultiPowerSO-30™ PC Board Figure 39. Chipset Configuration Figure 40. Auto and mutual Rthj-amb Vs PCB copper area in open box free air condition (according to page 20 definitions) Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35 µm, Copper areas: from minimum pad lay-out to 16cm2). HIGH SIDE CHIP HSAB LOW SIDE CHIP A LOW SIDE CHIP B LSA LSB 0 5 10 15 20 25 30 35 40 45 0 5 10 15 20 cm2 of Cu Are a (re fer to PCB layout) RthHS RthLS RthHSLS RthLSLS |
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