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AD9243EB 数据表(PDF) 20 Page - Analog Devices |
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AD9243EB 数据表(HTML) 20 Page - Analog Devices |
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20 / 25 page ![]() AD9243 REV. A –19– GROUNDING AND DECOUPLING Analog and Digital Grounding Proper grounding is essential in any high speed, high resolution system. Multilayer printed circuit boards (PCBs) are recom- mended to provide optimal grounding and power schemes. The use of ground and power planes offers distinct advantages: 1. The minimization of the loop area encompassed by a signal and its return path. 2. The minimization of the impedance associated with ground and power paths. 3. The inherent distributed capacitor formed by the power plane, PCB insulation, and ground plane. These characteristics result in both a reduction of electro- magnetic interference (EMI) and an overall improvement in performance. It is important to design a layout that prevents noise from coupling onto the input signal. Digital signals should not be run in paral- lel with input signal traces and should be routed away from the input circuitry. While the AD9243 features separate analog and digital ground pins, it should be treated as an analog compo- nent. The AVSS, DVSS and DRVSS pins must be joined together directly under the AD9243. A solid ground plane under the A/D is acceptable if the power and ground return currents are managed carefully. Alternatively, the ground plane under the A/D may contain serrations to steer currents in predictable directions where cross-coupling between analog and digital would other- wise be unavoidable. The AD9243/EB ground layout, shown in Figure 54, depicts the serrated type of arrangement. The analog and digital grounds are connected by a jumper below the A/D. Analog and Digital Supply Decoupling The AD9243 features separate analog and digital supply and ground pins, helping to minimize digital corruption of sensitive analog signals. FREQUENCY – kHz 120 100 1000 80 60 40 100 10 1 AVDD DVDD Figure 45. AD9243 PSSR vs. Frequency Figure 45 shows the power supply rejection ratio vs. frequency for a 200 mV p-p ripple applied to both AVDD and DVDD. In general, AVDD, the analog supply, should be decoupled to AVSS, the analog common, as close to the chip as physically possible. Figure 46 shows the recommended decoupling for the analog supplies; 0.1 µF ceramic chip capacitors should provide adequately low impedance over a wide frequency range. Note that the AVDD and AVSS pins are co-located on the AD9243 to simplify the layout of the decoupling capacitors and provide the shortest possible PCB trace lengths. The AD9243/EB power plane layout, shown in Figure 55 depicts a typical arrangement using a multilayer PCB. 0.1 F AVDD AVSS AD9243 0.1 F AVDD AVSS Figure 46. Analog Supply Decoupling The CML is an internal analog bias point used internally by the AD9243. This pin must be decoupled with at least a 0.1 µF capacitor as shown in Figure 47. The dc level of CML is ap- proximately AVDD/2. This voltage should be buffered if it is to be used for any external biasing. 0.1 F CML AD9243 Figure 47. CML Decoupling The digital activity on the AD9243 chip falls into two general categories: correction logic, and output drivers. The internal correction logic draws relatively small surges of current, mainly during the clock transitions. The output drivers draw large current impulses while the output bits are changing. The size and duration of these currents are a function of the load on the output bits: large capacitive loads are to be avoided. Note that the internal correction logic of the AD9243 is referenced DVDD while the output drivers are referenced to DRVDD. The decoupling shown in Figure 48, a 0.1 µF ceramic chip capacitor, is appropriate for a reasonable capacitive load on the digital outputs (typically 20 pF on each pin). Applications involving greater digital loads should consider increasing the digital decoupling proportionally, and/or using external buffers/ latches. 0.1 F DVDD DVSS AD9243 DRVDD DRVSS 0.1 F Figure 48. Digital Supply Decoupling A complete decoupling scheme will also include large tantalum or electrolytic capacitors on the PCB to reduce low-frequency ripple to negligible levels. Refer to the AD9243/EB schematic and layouts in Figures 51–55 for more information regarding the placement of decoupling capacitors. |
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