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XSL-375-TF-R2 数据表(PDF) 4 Page - Roithner LaserTechnik GmbH

部件名 XSL-375-TF-R2
功能描述  UV LED
PDF  5 Pages
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制造商  ROITHNER [Roithner LaserTechnik GmbH]
网页  http://www.roithner-laser.com
标志 ROITHNER - Roithner LaserTechnik GmbH

XSL-375-TF-R2 数据表(HTML) 4 Page - Roithner LaserTechnik GmbH

  XSL-375-TF-R2 Datasheet HTML 1Page - Roithner LaserTechnik GmbH XSL-375-TF-R2 Datasheet HTML 2Page - Roithner LaserTechnik GmbH XSL-375-TF-R2 Datasheet HTML 3Page - Roithner LaserTechnik GmbH XSL-375-TF-R2 Datasheet HTML 4Page - Roithner LaserTechnik GmbH XSL-375-TF-R2 Datasheet HTML 5Page - Roithner LaserTechnik GmbH  
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17.08.2017
XSL-375-TF-R2
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3. Soldering Conditions
• Solder the LEDs no closer than 3 mm from the base of the lead.
• Recommended soldering conditions:
Dip Soldering
Hand Soldering
Pre-Heat
120 °C Max.
Temperature
350 °C Max.
Pre-Heat Time
60 Seconds Max.
Soldering Time
3 Seconds Max.
Solder Bath Temperature 260 °C Max.
Position
Not closer than 3 mm from
the base of the epoxy bulb
Dipping Time
5 Seconds Max.
Dipping Position
No lower than 3 mm from
the base of the epoxy bulb
• Although the recommended soldering conditions are specified in the above table, dip or hand
soldering at the lowest possible temperature is desirable for the LEDs.
• A rapid-rate process is not recommended for cooling the LEDs down from the peak
temperature.
• Dip soldering and hand soldering should not be done more than one time.
• Do not apply any stress to the lead particularly when heated.
• The LEDs must not be repositioned after soldering.
• After soldering the LEDs, the lead should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
• Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be
caused from warping of the PC board or from the clinching and cutting of the lead frames.
When it is absolutely necessary, the LEDs may be mounted in this fashion but the customer
will assume responsibility for any problems. Direct soldering should only be done adter
testing has confirmed that no damage, such as wire bond failure or resin deterioration, will
occur. Those LEDs should not be soldered directly to double sided PC boards because the
heat will deteriorate the epoxy resin.
• When it is necessary to clamp the LEDs to prevent soldering failure, it is important to
minimize the mechanical stress on the LEDs.
• Cut the LED leads at room temperature. Cutting the leads at high temperature may cause
the failure of the LEDs.
4. Static Electricity
• The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended
that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
• All devices, equipment and machinery must be grounded properly. It is recommended that
precautions should be taken against surge voltage to the equipment that mounts the LEDs.



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