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GWDASPA1.EC 数据表(PDF) 17 Page - OSRAM GmbH |
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GWDASPA1.EC 数据表(HTML) 17 Page - OSRAM GmbH |
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17 / 26 page  Version 1.5 GW DASPA1.EC 2017-12-12 17 Note: Package not suitable for ultra sonic cleaning. For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Anm.: Das Gehäuse ist für Ultraschallreinigung nicht geeignet. Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. |
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