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DMN3035LWN-13 数据表(PDF) 2 Page - Diodes Incorporated

部件名 DMN3035LWN-13
功能描述  30V DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
PDF  7 Pages
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制造商  DIODES [Diodes Incorporated]
网页  http://www.diodes.com
标志 DIODES - Diodes Incorporated

DMN3035LWN-13 数据表(HTML) 2 Page - Diodes Incorporated

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DMN3035LWN
Document number: DS37528 Rev. 3 - 2
2 of 7
www.diodes.com
October 2016
© Diodes Incorporated
DMN3035LWN
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Drain-Source Voltage
VDSS
30
V
Gate-Source Voltage
VGSS
±20
V
Continuous Drain Current (Note 6) VGS = 10V
Steady
State
TA = +25°C
TA = +70°C
ID
5.5
4.4
A
Maximum Continuous Body Diode Forward Current (Note 6)
IS
1
A
Pulsed Drain Current
IDM
30
A
Avalanche Current (Note 7) L = 0.1mH
IAS
A
Avalanche Energy (Note 7) L = 0.1mH
EAS
mJ
Thermal Characteristics
Characteristic
Symbol
Value
Units
Total Power Dissipation (Note 5)
TA = +25°C
PD
0.77
W
TA = +70°C
0.49
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
RJA
162
°C/W
t<10s
116
Total Power Dissipation (Note 6)
TA = +25°C
PD
1.78
W
TA = +70°C
1.10
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
RJA
71
°C/W
t<10s
50
Thermal Resistance, Junction to Case (Note 6)
RJC
10.7
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
BVDSS
30


V
VGS = 0V, ID = 250μA
Zero Gate Voltage Drain Current TJ = +25°C
IDSS


1.0
μA
VDS = 30V, VGS = 0V
Gate-Source Leakage
IGSS


±100
nA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
VGS(TH)
1.0
2.0
V
VDS = VGS, ID = 250μA
Static Drain-Source On-Resistance
RDS(ON)
26
34
35
45
m
VGS = 10V, ID = 4.8A
VGS = 4.5V, ID = 4.3A
Diode Forward Voltage
VSD
0.75
1.1
V
VGS = 0V, IS = 1A
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Ciss
399
pF
VDS = 15V, VGS = 0V,
f = 1.0MHz
Output Capacitance
Coss
57
pF
Reverse Transfer Capacitance
Crss
50
pF
Gate Resistance
Rg
1.36
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge (VGS = 4.5V)
Qg
4.5
nC
VDS = 15V, ID = 5.8A
Total Gate Charge (VGS = 10V)
Qg
9.9
nC
Gate-Source Charge
Qgs
1.2
nC
Gate-Drain Charge
Qgd
1.8
nC
Turn-On Delay Time
tD(ON)
3.0
ns
VDD = 15V, VGS = 10V,
RL = 2.6Ω, RG = 3Ω
Turn-On Rise Time
tR
3.3
ns
Turn-Off Delay Time
tD(OFF)
10.6
ns
Turn-Off Fall Time
tF
2.0
ns
Reverse Recovery Time
tRR

7.9

ns
IF = 4.8A, di/dt = 100A/μs
Reverse Recovery Charge
QRR

2.4

nC
IF = 4.8A, di/dt = 100A/μs
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.



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