AD5560JSVUZ datasheet(64/67 Pages) AD

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Data Sheet

AD5560

Rev. E | Page 63 of 66

APPLICATIONS INFORMATION

THERMAL CONSIDERATIONS

Table 28. Thermal Resistance for TQFP_EP1

Cooling

Airflow (LFPM)

JC (Uniform)

JC (Local)

Ideal TIM6

θJC(Local)

w/TIM6

θJCP

w/TIM5

Unit

No Heat Sink

N/A

°C/W

200

37.2

°C/W

500

35.7

°C/W

Heat Sink7

12.2

N/A

°C/W

200

11.1

1.0

2.8

4.91

°C/W

500

9.5

°C/W

Cold Plate8

N/A

1.0

2.8

4.91

7.5

°C/W

1 All numbers are simulated and assume a JEDEC 4-layer test board.

2 θ

JA is the thermal resistance from hottest junction to ambient air.

3 θ

JC (Uniform) is the thermal resistance from junction to the package top, assuming total power is uniformly distributed.

4 θ

JC (Local) is the thermal resistance from junction to the center of package top, assuming total power = 8.5 W (1 W uniformly distributed, 7.5 W in power stages—local

heating).

5 θ

JCP is the thermal resistance from hottest junction to infinite cold plate with consideration of thermal interface material (TIM).

6 Ideal TIM is assuming top of package in perfect contact with an infinite cold plate. w/TIM is assuming TIM is 0.5 mm thick, with thermal conductivity of 2.56 W/m/k.

7 Heat sink with a rated performance of θ

CA ~5.3°C/W under forced convection, gives ~TJ = 111°C at 500 LFM. Thermal performance of the package depends on the heat

sink and environmental conditions.

8 Attached infinite cold plate should be ≤26°C to maintain T

J < 90°C, given total power = 8.5 W. Thermal performance of the package depends on the heat sink and

environmental conditions.

9 To estimate junction temperature, the following equations can be used:

TJ = Tamb + θJA × Power

TJ = Tcoldplate + θJCP × Power

TJ = Ttop + θJC × Power

Table 29. Thermal Resistance for Flip Chip BGA1

Cooling

Airflow (LFPM)

JC (Uniform)

JC (Local)

Ideal TIM6

JC (Local)

w/TIM6

JCP

w/TIM

Unit

No Heat Sink

40.8

N/A

°C/W

200

38.1

°C/W

500

°C/W

Heat Sink8

N/A

°C/W

200

11.8

0.05

1.6

4.6

°C/W

500

°C/W

Cold Plate9

N/A

0.05

1.6

4.6

6.5

°C/W

1 All numbers are simulated and assume a JEDEC 4-layer test board.

2 θ

JA is the thermal resistance from hottest junction to ambient air.

3 θ

JC (Uniform) is the thermal resistance from junction to the package top, assuming total power is uniformly distributed.

4 θ

JC (Local) is the thermal resistance from junction to the center of package top, assuming total power = 8.5 W (1 W uniformly distributed, 7.5 W in power stages—local

heating).

5 θ

JCP is the thermal resistance from hottest junction to infinite cold plate with consideration of thermal interface material (TIM).

6 Ideal TIM is assuming top of package in perfect contact with an infinite cold plate. w/TIM is assuming TIM is 0.4 mm thick, with thermal conductivity of 3.57 W/m/k.

7 Heat sink with a rated performance of θ

CA ~4.9°C/W under forced convection, gives ~TJ = 112°C at 500 LFM. Thermal performance of the package depends on the heat

sink and environmental conditions.

8 Attached infinite cold plate should be ≤30°C to maintain T

J < 90°C, given total power = 8.5 W. Thermal performance of the package depends on the heat sink and

environmental conditions.

9 To estimate junction temperature, the following equations can be used:

TJ = Tamb + θJA × Power

TJ = Tcoldplate + θJCP × Power

TJ = Ttop + θJC × Power

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