LAN9115 datasheet(7/7 Pages) SMSC

7 / 7 page

Highly Efficient Single-Chip 10/100 Non-PCI Ethernet Controller

SMSC LAN9115

Revision 0.1 (12-20-04)

PRODUCT PREVIEW

Package Outline

Notes:

1 Controlling Unit: millimeter.

2 Tolerance on the true position of the leads is ± 0.04 mm maximum.

3 Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm.

4 Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5 Details of pin 1 identifier are optional but must be located within the zone indicated.

Figure 4 100 Pin TQFP Package Outline

Table 1 100 Pin TQFP Package Parameters

MIN

NOMINAL

MAX

REMARKS

1.60

Overall Package Height

0.05

0.15

Standoff

1.35

1.45

Body Thickness

15.80

16.20

X Span

13.90

14.10

X body Size

15.80

16.20

Y Span

13.90

14.10

Y body Size

0.09

0.20

Lead Frame Thickness

0.45

0.60

0.75

Lead Foot Length

1.00

Lead Length

0.50 Basic

Lead Pitch

~7o

Lead Foot Angle

0.17

0.22

0.27

Lead Width

0.08

Lead Shoulder Radius

0.08

0.20

Lead Foot Radius

ccc

0.08

Coplanarity

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