LSP47F_13 datasheet(12/21 Pages) OSRAM

12 / 21 page

2013-10-11

Version 1.3

LS P47F

Recommended Solder Pad 9) page 20

reflow soldering

Empfohlenes Lötpaddesign 9) Seite 20

Reflow-Löten

Recommended Solder Pad 9) page 20

reflow soldering

Empfohlenes Lötpaddesign 9) Seite 20

Reflow-Löten

Note:

The lower solder pad layout represents the

recommended solder pad for top mounting.

OHAY1307

Hole in PCB

Solder resist

Lötstoplack

(ø2.1 (0.083)

2.6 (0.102)

3.6 (0.142)

(0.5 (0.020))

+0.1 (0.004)

Padgeometrie für verbesserte Wärmeableitung

Paddesign for improved heat dissipation

Bauteil positioniert, Rückseite

Component location on pad, backside

)

OHAY2629

Lötstoplack

Solder resist

ø2.3 (0.091)

2.6 (0.102)

0.7 (0.028)

No solder resist; no copper pad

Kein Lötstoplack; kein Kupfer

LSP47F 数据表(PDF) 12 Page - OSRAM GmbH

LSP47F 数据表(HTML) 12 Page - OSRAM GmbH

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