© 2003 California Micro Devices Corp. All rights reserved.

2

430 N. McCarthy Blvd., Milpitas, CA 95035-5112

L Tel: 408.263.3214

L Fax: 408.263.7846 L www.calmicro.com

12/10/03

CSPESD301/302/303

Ordering Information

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.

Note 2: Lead-free devices are specified by using a "

B2

B1

A1

A2

Orientation

Marking

2

1

B

A

n*

Orientation

Marking

(see note 2)

PACKAGE / PINOUT DIAGRAMS

Notes:

CSPESD301/302/303

TOP VIEW

BOTTOM VIEW

(Bumps Down View)

(Bumps Up View)

* See ordering information for

appropriate part marking.

1) These drawings are not to scale.

2) Lead-free devices are specified by using a "+" character for the top side orientation mark.

4-Bump CSP Package

3) All 4 bumps are always present. Unused bumps are electrically unconnected.

PART NUMBERING INFORMATION

Bumps

Package

Standard Finish

Ordering Part

Part Marking

Ordering Part

Part Marking

4

CSP

CSPESD301

F

CSPESD301G

F

4

CSP

CSPESD302

G

CSPESD302G

G

4

CSP

CSPESD303

H

CSPESD303G

H