LS5221

THRU

LS5267

500 mW

Zener Diode

2.4 to 75 Volts

Features

•

Glass Package

•

High Temp Soldering: 260

°C for 10 Seconds At Terminals

•

Surface Mount Package

Maximum Ratings

•

Operating Temperature: -55

°C to +175°C

•

Storage Temperature: -55

°C to +175°C

•

500 mWatt DC Power Dissipation

•

Power Derating: 5.0mW/

°C above 50°C

•

Forward Voltage @ 200mA: 1.1 Volts

Figure 2 - Derating Curve

Power Dissipation (mW) -

Versus - Ambient Temperature °C

Temperature

°C

mW

200

400

Typical Capacitance (pf) –

versus – Zener voltage (V

Figure 1 - Typical Capacitance

0

100

200

1

10

100

pf

At zero volts

omponents

20736 Marilla

Street Chatsworth



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MCC

Revision: 4

2009/01/20

1 of 3

Marking : Cathode band denotes polarity

TM

Micro Commercial Components

Quadro MELF

SUGGESTED SOLDER

PAD LAYOUT

DIMENSIONS

INCHES

MM

DIM

MIN

MAX

MIN

MAX

NOTE

A

.130

.146

3.30

3.70

B

.008

.016

.20

.40

C

.055

.063

1.40

1.60

∅

D

.067

1.70

.155”

.022”

.065”

A

B

Cathode Mark

C

D

•

Outline Similar To JEDEC DO-213AA

•

Thermal Resistence : Junction to ambient Rthja=300K/W

25

50

75

100 125 150 175

•

Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix designates

RoHS Compliant. See ordering information)

Note:1.Lead in Glass Exemption Applied, see EU Directive Annex 5.