Features

Planar Die construction

Mechanical Data

Approx. Weight: 0.008 gram

Mounting Position: Any

Storage & Operating Junction Temperature:

-55

Maximum Ratings @ 25

Forward Current

10

mA

Maximum Forward

Voltage

(Notes 1)

0.9

V

Power Dissipation

(No te s

2)

200

mWatt

Thermal Resistance,

625

o

C/W

NOTES:

MMXZ5223B

THRU

MMXZ5259B

200 mW

Zener Diodes

2.7 to 39 Volts

MCC

1. Tested with pulses, Tp<1.0ms

2. Device mounted on ceramic PCBS; 7.6 mm x 9.4 mm x 0.87 mm

Junction to Ambient Air

with pad areas 25 mm

omponents

20736 Marilla Street Chatsworth



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TM

Micro Commercial Components

1 of 5

Lead Free Finish/RoHS Compliant ("P" Suffix

designates RoHS Compliant. See ordering information)

Revision:

C

20

13/01/01

DIMENSIONS

INCHES

MM

DIM

MIN

MAX

MIN

MAX

NOTE

A

.090

.107

2.30

2.70

B

.063

.071

1.60

1.80

C

.045

.053

1.15

1.35

D

.031

.045

0.80

1.15

E

.010

.016

0.25

0.40

G

.004

.018

0.10

0.45

H

.004

.010

0.10

0.25

J

-----

.006

-----

0.15

A

B

E

C

J

D

H

G

SOD

-323

0.022”

0.074"

0.027”

SUGGESTED SOLDER

PAD LAYOUT

Epoxy meets UL 94 V-0 flammability rating

Moisture Sensitivity Level 1

Halogen free available upon request by adding suffix "-HF"

Ideally Suited for Automated Assembly Processes

Zener Voltages from 2.7V-39V and 200mW Power Dissipation