MM

XZ5229C

THRU

MM

XZ5262C

200 mW

Zener Diode

4.3 to 51 Volts

Features

•

Wide Voltage Range Available

•

Small Outline Package For Space Savings

•

High Temp Soldering: 260

°C for 10 Seconds At Terminals

•

Surface Mount Package

•

Operating

Junction Temperature: -55°C to +150°C

•

Storage Temperature: -55

°C to +150°C

Maximum Ratings

Maximum Ratings @ 25

Zener Current

100

mA

Maximum Forward

Voltage

0.9

V

Power Dissipation

(No te s A)

Pe ak Forward S urge

4.0

Amps

NOTES:

A. Mounted on FR4 PC board with our suggested solder pad layout .

B. Measured on 8.3ms, single half sine-wave or equivalent

Current (Not e s B)

omponents

20736 Marilla Street Chatsworth



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MCC

TM

Micro Commercial Components

200

mWatt

•

Maximum Thermal Resistance; 357

°C/W Junction To Ambient

•

Lead Free Finish/RoHS Compliant ("P" Suffix designates

RoHS Compliant. See ordering information)

•

Epoxy meets UL 94 V-0 flammability rating

•

Moisture Sensitivity Level 1

SOD

-323

Revision:

B

20

13/06/25

1 of 4

A

B

E

C

D

H

G

DIMENSIONS

INCHES

MM

DIM

MIN

MAX

MIN

MAX

NOTE

A

.090

.107

2.30

2.70

B

.068

.078

1.75

1.95

C

.045

.053

1.15

1.35

D

.027

.038

0.70

0.95

E

.010

.014

0.25

0.35

G

.012

---

0.30

---

H

.002

.006

0.05

0.15

0.022”

0.069"

0.032”

SUGGESTED SOLDER

PAD LAYOUT

•

Halogen free available upon request by adding suffix "-HF"