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TLOU262 数据表(PDF) 2 Page - Toshiba Semiconductor |
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TLOU262 数据表(HTML) 2 Page - Toshiba Semiconductor |
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2 / 6 page ![]() TLOU262,TLSU262,TLYU262 2002-09-25 2 Electrical And Optical Characteristics (Ta = 25°C) Typ.Emission Wavelength Luminous Intensity IV Forward Voltage VF Reverse Current IR Product lP Dl IF Min Typ. IF Typ. Max IF Max VR TLOU262 612 15 20 47.6 300 20 2.0 2.4 20 50 4 TLSU262 636 17 20 47.6 170 20 2.0 2.4 20 50 4 TLYU262 590 13 20 47.6 150 20 2.1 2.5 20 50 4 Unit nm mA mcd mA V mA mA V Precaution Please be careful of the followings · Soldering temperature: 260°C max Soldering time: 3 s max (soldering portion of lead: Up to 2 mm from the body of the device) · If the lead is formed, the lead should be formed up to 5 mm from the body of the device without forming stress to the resin. Soldering should be performed after lead forming. · This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp,please ensure that it will not be affected by this IR light. |
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