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Part No. : LTE-S9511TS-R

BNS-OD-FC 002/A4

IR Emitter

LTE-S9511TS-R

8. CAUTIONS

8.1. Application

The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication

equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional

reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in

aviation, transportation, traffic control equipment, medical and life support systems and safety devices).

8.2. Storage

The package is sealed:

The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within

one year, while the LEDs is packed in moisture-proof package with the desiccants inside.

The package is opened:

The storage ambient for the LEDs should not exceed 30°C temperature or 60% relative humidity.

It is recommended that LEDs out of their original packaging are IR-reflowed within one week hrs.

For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with

appropriate desiccant, or in a desiccators with nitrogen ambient.

LEDs stored out of their original packaging for more than one week hrs should be baked at about 60 deg C for at least 20

hours before solder assembly.

8.3. Cleaning

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.

8.4. Soldering

Recommended soldering conditions:

Reflow Soldering

Soldering iron

Pre-heat

Pre-heat time

Peak temperature

Soldering time

150~200°C

120 seconds Max.

260°C Max.

10 seconds Max.(Max. two times)

Temperature

Soldering time

300°C Max.

3 seconds Max.

(one time one)

Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit boards, no

single temperature profile works for all possible combinations.

However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific

characterization.

LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly.

The results of this testing are verified through post-reflow reliability testing.

Profiles used at LITE-ON are based on JEDEC standards to ensure that all packages can be successfully and reliably surface

mounted.

Figure on page3 shows a sample temperature profile compliant to JEDEC standards.

You can use this example as a generic target to set up your reflow process.

You should adhere to the JEDEC profile limits as well as specifications and recommendations from the solder paste

manufacturer to avoid damaging the device and create a reliable solder joint.

8.5. Drive Method

An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an

application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as

shown in Circuit A below.