30 MICSW

01/2018

2

*a

cranked solder contacts

*b

contact 1

*c

printed circuit board layout, solder side view

*d

necessary space for use of pull-off tongs AZ30

*e

component area (B x 7)

*f

recommended thickness of circuit board 1.5 ±0.14 mm

Environmental conditions

Temperature range

1

upper limit temperature (insulating body) RTI (electrical) of the UL Yellow Card

Materials

Insulating body

PA GF, V-0 according to UL94

Contact tab

CuZn, pre-nickel and tin-plated –

MICSW

CuZn, pre-nickel and gold-plated –

MICSW AU

Mechanical data

Expression force contact tab from

insulating body

≥ 7 N/contact

Rated current

1,2 A

Rated voltage

160 V AC

(250 V AC ohne Berücksichtigung

der Kriech- und Luftstrecken nach

IEC 60664/DIN EN 60664)

Material group

I (IEC)/0 (UL) (CTI ≥ 600)

Creepage distance

0,97 mm

Clearance

0,97 mm

Insulation resistance

> 1 GΩ

of 3