Maximum Ratings

Operating JunctionTemperature: -40

Storage Temperature: -40

Electrical Characteristics @ 25

NOTES:1.Electrical characteristics applicable in both forward and

reverse directions.

2.Connected in parallel with the devices.

SILICON

BIDIRECTIONAL

DIAC

Power dissipation

on Printed

Circuit(l=10mm)

150mW

T

Repetitive Peak

on-state Current

2.0A

p

C=22nF(Note 2)

Breakover Voltage

Symmetry

C=22nF(Note 2)

Output

Voltage(Note 1)

V

o(min)

5V

Breakover

Current(Note 1)

50uA

C=22nF

Rise Time(Note 1)

2.0us

Leakage

Current(Note 1)

10uA

omponents

20736 Marilla

Street Chatsworth



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MCC

Revision:

B

20

12/05/12

Breakover Voltage: 32V

Breakover Voltage Range: 28V to

36V

LSDB3

Features

Min Typ Max

28 32 36V

±3V

Breakover Voltage

=20us,f=120Hz

t

TM

Micro Commercial Components

Quadro MELF

SUGGESTED SOLDER

PAD LAYOUT

DIMENSIONS

INCHES

MM

DIM

MIN

MAX

MIN

MAX

NOTE

A

.130

.146

3.30

3.70

B

.008

.016

.20

.40

C

.055

.063

1.40

1.60

∅

D

.067

1.70

.155”

.022”

.065”

A

B

C

D

1 of 3

Epoxy meets UL 94 V-0 flammability rating

Moisture Sensitivity Level 1

Lead Free Finish/RoHS Compliant(Note 3) ("P" Suffix designates

RoHS Compliant. See ordering information)

3.Lead in Glass Exemption Applied, see EU Directive Annex 7(C)-I.