DATA SHEET

HAR 24xy

Micronas

July 14, 2015; DSH000170_001EN

21

4.2. Soldering, Welding and Assembly

Information related to solderability, welding, assembly, and second-level packaging is included in the document

“Guidelines for the Assembly of Micronas Packages”.

It is available on the Micronas website (http://www.micronas.com/en/service-center/downloads) or on the service

portal (http://service.micronas.com).

4.3. Pin Connections and Short Descriptions

All not connected (NC) pins must be connected to

GND. In case of redundancy requirements Micronas

recommends the following grounding:

• GND plane1: Pin 1, 3, 5, 7

• GND plane2: Pin 8, 10, 12, 14

• GND plane3: Pin 4, 11

To avoid a separate GND plane3, please connect

either pin 4 or pin 11 to the nearest GND and leave the

other pin not connected.

Note: To minimize mechanical stress to the dies, the

exposed pad should not be soldered!

Fig. 4–3: Pin configuration

Fig. 4–4: Top/side view of the package.

4.4. Dimensions of Sensitive Area

4.5. Package Parameter and Position of Sensitive

Areas

Pin

No

Pin

Name

Type

Short Description

Die 1

2

VSUP1

SUPPLY

Supply Voltage die 1

3

GND1

GND

Ground die 1

4

GNDePad

GNDePad

Ground ePad

6

OUT1

I/O

Push-Pull Output

(HAR 2425)

or

PWM Output

(HAR 2455)

and Programming Pin

Die 1

Die 2

9

VSUP2

SUPPLY

Supply Voltage die 2

11

GNDePad

GNDePad

Ground ePad

12

GND2

GND

Ground die 2

13

OUT2

I/O

Push-Pull Output

(HAR 2425)

or

PWM Output

(HAR 2455)

and Programming Pin

Die 2

TSSOP14-1

x1 = x2

0 mm nominal

y1 = y2

0.21 mm nominal

z1

0.55 mm nominal

z2

0.33 mm nominal

Bd1

0.3 mm

Bd2

0.3 mm

2

12

Pin 13

VSUP1

OUT2

GND2

3

Pin 6

OUT1

GND1

VSUP2

9

4GNDePad

11

GNDePad

2

11

VSUP1

GND2

4

6

OUT1

GND1

VSUP2

9

OUT2

13

5

12

GNDePad

GNDePad

1

3

7

10

8

14

NC

NC

NC

NC

NC

NC