Version 1.2

SFH 7779

2016-04-25

29

Recommended solder pad design

Dimensions in mm (inch).

Cleaning / Washing

In general, OSRAM Opto Semiconductors does not recommend a wet cleaning process for the

components SFH7779 as the package is not hermetically sealed. Due to the open design, all kind of

cleaning liquids can infiltrate the package and cause a degradation or a complete failure of the LED or

ASIC. It is also recommended to prevent penetration of organic substances from the environment which

could interact with the hot surfaces of the operating chips. Ultrasonic cleaning is generally not

recommended for all types of LEDs (see also the application note "Cleaning of LEDs"). As is standard

for the electronic industry, OSRAM Opto Semiconductors recommends using low-residue or no-clean

solder paste, so that PCB cleaning after soldering is no longer required. In any case, all materials and

methods should be tested beforehand in order to determine whether the component will be damaged in

the process.