Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks

of Cree, Inc.

10

Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc.

10

Cree PLCC6 3 in 1 SMD LED

CLV6D-FKB

REFLOW SOLDERING

•

The CLV6D-FKB is rated as a MSL 5a product.

•

The recommended floor life out of bag is 24hrs.

•

•

The temperature profile is as below:

Use only with CLV6D-FKB

Soldering pad:

Solder

Average ramp-up rate = 4ºC/s max

Preheat temperature = 150ºC ~200ºC

Preheat time = 120s max

Ramp-down rate = 6ºC/s max

Peak temperature = 250ºC max

Time within 5ºC of actual Peak Temperature = 10s max

Duration above 217ºC is 45s max

Document No.: COTCO-05-0057

Rev. NO.

:

13

6/9

Melting-point

Pre-heat

Soak

Reflow

Cooling

Time

Use all SMD besides LP6-NPP1-01-N1

Solder = Sn63-Pb37

Solder = Lead-free

Average ramp-up rate = 4ºC/s max.

Average ramp-up rate = 4ºC/s max

Preheat temperature = 100ºC ~150ºC

Preheat temperature = 150ºC ~200ºC

Preheat time = 100s max.

Preheat time = 100s max.

Ramp-down rate = 6ºC/s max.

Ramp-down rate = 6ºC/s max.

Peak temperature = 230ºC max.

Peak temperature = 250ºC max.

Time within 5ºC of actual Peak Temperature = 10s max.

Time within 5ºC of actual Peak Temperature = 10s max.

Duration above 183ºC is 80s max.

Duration above 217ºC is 80s max.

Only use LP6-NPP1-01-N1

[13]

Solder = Low Lead-free

Average ramp-up rate = 3ºC/s max.

Preheat temperature = 130ºC ~170ºC

Preheat time = 120s max.

Ramp-down rate = 6ºC/s max.

Peak temperature = 213ºC max.

Time within 3ºC of actual Peak Temperature = 25s max.

Duration above 200ºC is 40s max.

Recommended solder pad design for heat dissipation (2-pin SMD LED):

7.0

2.6



Recommended solder pad design for heat dissipation (4-pin SMD LED)

8.2

2.7