Specificationsaresubjecttochangewithoutnotice.

Thedevicecharacteristicsandparametersinthisdatasheetcananddovaryindifferentapplicationsandactualdeviceperformancemayvaryovertime.

Usersshouldverifyactualdeviceperformanceintheirspecificapplications.

Packaging Dimensions

2.0±0.5

(.079±.020)

178±2.0

(7.008±.079)

9.0±0.5

(.354±.020)

13.0±1.0

(.512±.039)

13.0±0.5

(.512±.020)

62.0±1.5

(2.441±.059)

21.0±0.8

(.827±.031)

DIMENSIONS:

MM

(INCHES)

REV.A03/18

8.0±0.1

(.315±.004)

1.75±0.05

(.069±.002)

3.5±0.05

(.138±0.002)

0.60±0.03

(.024±.0012)

1.04±0.03

(.041±.0012)

0.78±0.03

(.031±.0012)

2.0±0.05

(.079±.002)

1.55±0.05

(.061±.002)

DIA.

2.0±0.05

(.079±.002)

4.0±0.10

(.157±.004)

Solder Reflow Recommendations

Per J-STD-020C

A 1st Rising

The Normal to

30 s to 60 s

Temperature

Preheating

Temperature

B Preheating

140 °C to 160 °C

60 s to 120 s

C 2nd Rising

Preheating to 200 °C 20 s to 40 s

Temperature

D Main Heating

if 220 °C

50 s ~ 60 s

if 230 °C

40 s ~ 50 s

if 240 °C

30 s ~ 40 s

if 250 °C

20 s ~ 40 s

if 260 °C

20 s ~ 40 s

E Regular Cooling

200 °C to 100 °C

1 °C/s ~ 4 °C/s

A

C

TIME

D

E

B

STANDARD = 10,000 pieces per reel