AM29DL32XG datasheet(57/58 Pages) AMD

57 / 58 page

February 9, 2005

Am29DL32xG

DA TA SH EET

REVISION SUMMARY

Revision A (November 7, 2001)

Global

Initial release. This device replaces the AM29DL32xD.

Revision B (July 31, 2002)

Global

Added LAA064 package.

Ordering Information

Corrected package marking for FBGA.

AC Characteristics

Added 70 ns speed grade to Test Specifications and

Read-Only Operations

Revision B + 1 (August 27, 2002)

Distinctive Characteristics

Changed write cycles guaranteed per sector to erase

cycles guaranteed per sector.

Connection Diagrams, Special Handling

Instructions for FBGA Package

Changed text to reflect revised handling instructions.

Ordering Information

Added 120 ns to Valid Combinations for TSOP Pack-

ages.

Table 7, Autoselect Codes, (High Voltage Method)

Changed SecSi

TM Indicator Bit (DQ7 to DQ0) from 81h

to 82h (factory locked); 01h to 02h (not factory locked).

Sector/Sector Block Protection and Unprotection

Removed paragraph referring to programming equip-

ment.

Common Flash Memory Interface (CFI)

Corrected third paragraph text to indicate that reset

command will return device to reading array data.

Changed CFI URL to current link.

Command Definitions

Corrected first paragraph text regarding incorrect ad-

dress and data values.

Table 14, Command Definitions

Changed Sector/Sector Block Protect Verify fourth bus

cycle from 81/01 to 82/02.

DC Characteristics, CMOS Compatible

Removed IACC from table.

AC Characteristics, Alternate CE# Controlled

Erase and Program Operations

Change t

BHEL from 0b to 0.

TSOP and SO Pin Capacitance

Added Fine-Pitch BGA capacitance to table.

Revision B + 2 (November 6, 2002)

Global

Removed 60 ns speed option and references to 80 ns

speed option.

Removed reverse 48-pin TSOP package option.

Connection Diagrams, 64-Ball Fortified BGA

Changed RFU to NC.

Package Capacitance

Removed references to SO package.

Revision B + 3 (April 21, 2003)

Connection Diagrams

Updated 64-Ball Fortified FBA (11 x 13 mm); changed

C5 from A21 to NC.

Revision B + 4 (March 26, 2004)

Connection Diagrams

Updated arr ay n u mber ing sch eme of 48-Ball

Fine-pitch FBA (6 x 12 mm) to match the physical dia-

gram.

Revision B + 5 (May 20, 2004)

Global

Converted document to full datasheet version.

Table 5, “Bottom Boot Sector Addresses”

Added table.

Revision B + 6 (June 4, 2004)

Ordering Information

Added Lead-free (Pb-free) options to the Temperature

Range breakout of the OPN table and the Valid Com-

binations table.

Revision B + 7 (September 27, 2004)

Cover sheet and title page

Added notation to superseding documents.

AM29DL32XG 数据表(PDF) 57 Page - Advanced Micro Devices

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