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DNLS350Y 数据表(PDF) 2 Page - Diodes Incorporated

部件名 DNLS350Y
功能描述  LOW VCE(SAT) NPN SURFACE MOUNT TRANSISTOR
PDF  8 Pages
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制造商  DIODES [Diodes Incorporated]
网页  http://www.diodes.com
标志 DIODES - Diodes Incorporated

DNLS350Y 数据表(HTML) 2 Page - Diodes Incorporated

  DNLS350Y Datasheet HTML 1Page - Diodes Incorporated DNLS350Y Datasheet HTML 2Page - Diodes Incorporated DNLS350Y Datasheet HTML 3Page - Diodes Incorporated DNLS350Y Datasheet HTML 4Page - Diodes Incorporated DNLS350Y Datasheet HTML 5Page - Diodes Incorporated DNLS350Y Datasheet HTML 6Page - Diodes Incorporated DNLS350Y Datasheet HTML 7Page - Diodes Incorporated DNLS350Y Datasheet HTML 8Page - Diodes Incorporated  
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DNLS350Y
Document number: DS31208 Rev. 6 - 2
2 of 8
www.diodes.com
June 2017
© Diodes Incorporated
DNLS350Y
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
VCBO
50
V
Collector-Emitter Voltage
VCEO
50
V
Emitter-Base Voltage
VEBO
5
V
Peak Pulse Collector Current
ICM
5
A
Continuous Collector Current
IC
3
A
Base Current
IB
0.5
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Power Dissipation
(Note 5)
PD
1
W
(Note 6)
1.6
(Note 7)
2.0
Thermal Resistance, Junction to Ambient Air
(Note 5)
RθJA
125
°C/W
(Note 6)
78
(Note 7)
62.5
Thermal Resistance, Junction to Lead
(Note 8)
RθJL
5.7
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
ESD Ratings (Note 9)
Characteristic
Symbol
Value
Unit
JEDEC Class
Electrostatic Discharge - Human Body Model
ESD HBM
4,000
V
3A
Electrostatic Discharge - Machine Model
ESD MM
400
V
C
Notes:
5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR-4 PCB; device is measured
under still air conditions whilst operating in a steady-state.
6. Same as note (5), except the device is mounted on 25mm x 25mm 1oz copper.
7. Same as note (5), except the device is mounted on 50mm x 50mm 1oz copper.
8. Thermal resistance from junction to solder-point (on the exposed collector pad).
9. Refer to JEDEC specification JESD22-A114 and JESD22-A115.



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