© 2017 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 03/22/17

Radial Leaded > 250R Series

Environmental Specifications

Operating/Storage

Temperature

-40°C to +85°C

Maximum Device Surface

Temperature in Tripped State

125°C

Passive Aging

65°C/85°C, 1000 hours

Humidity Aging

+85°C, 85% R.H,.1000 hours

Thermal Shock

MIL–STD–202, Method 107

+125°C to -55°C 10 times

Solvent Resistance

MIL–STD–202, Method 215

Moisture Sesitivity Level

Level 1, J–STD–020

Physical Specifications

Lead Material

Tin-plated Copper

Soldering

Characteristics

Solderability per MIL–STD–202,

Method 208

Insulating Material

Cured, flame retardant epoxy polymer

meets UL94V-0 requirements.

Device Labeling

Marked with 'LF', voltage, current rating,

and date code.

Soldering Parameters - Wave Soldering

Condition

Wave Soldering

PeakTemp/ DurationTime

260°C < 5 Sec

> 220°C

2 Sec ~ 20 Sec

Preheat 140°C ~ 180°C

180 Sec ~ 210 Sec

Storage Condition

0°C~35°C < 70%RH

• Recommended soldering methods: heat element oven or

N

• Devices are designed to be wave soldered to the bottom

side of the board.

• Devices can be cleaned using standard industry methods

and solvents.

• This profile can be used for lead-free device

Note: If soldering temperatures exceed the recommended

profile, devices may not meet the performance

requirements.

Preheating

160

190

220

260

0

2 to 5

Soldering

Cooling

20-30

180 to 210

Time(s)

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test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.

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