Released

LH CPDP

2011-03-21

13

Lötbedingungen

Vorbehandlung nach JEDEC Level 2

Soldering Conditions

Preconditioning acc. to JEDEC Level 2

Reflow Lötprofil für bleifreies Löten

(nach J-STD-020D.01)

Reflow Soldering Profile for lead free soldering

(acc. to J-STD-020D.01)

Profile Feature

Pb-Free (SnAgCu) Assembly

Recommendation

Max. Ratings

Ramp-up Rate to Preheat*

)

25°C to 150°C

2°C / s

3°C / s

Time t

(150°C to 200°C

100 s

min. 60 s max. 120 s

Ramp-up Rate to Peak*

)

180°C to T

P

2°C / s

3°C / s

Liquidus Temperture T

L

217°C

Time t

80 s

max. 100 s

Peak Temperature T

P

245°C

max. 260°C

Time t

peak temperature T

20 s

min. 10 s max. 30 s

Ramp-down Rate*

T

3 K / s

6 K / s maximum

Time 25°C to Peak temperature

max. 8 min.

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation

ΔT/Δt: Δt max. 5 sec; fulfillment for the whole T-range

0

0

s

OHA04525

50

100

150

200

250

300

50

100

150

200

250

300

t

T

˚C

S

t

t

P

t

T

p

240 ˚C

217 ˚C

245 ˚C

25 ˚C

L