2011-07-25

18

LE CW S2LN

Lötbedingungen

Vorbehandlung nach JEDEC Level 4

Soldering Conditions

Preconditioning acc. to JEDEC Level 4

Reflow Lötprofil für bleifreies Löten

(nach J-STD-020D.1)

Reflow Soldering Profile for lead free soldering

(acc. to J-STD-020D.1)

Anm.: Das Gehäuse ist nicht für nasschemische Reinigung geeignet.

Note: Package not suitable for wetcleaning.

Profile Feature

Pb-Free (SnAgCu) Assembly

Recommendation

Max. Ratings

Ramp-up Rate to Preheat*

)

25°C to 150°C

2°C / sec

3°C / sec

Time t

(150°C to 200°C

100s

min. 60sec max. 120sec

Ramp-up Rate to Peak*

)

T

2°C / sec

3°C / sec

Liquidus Temperture T

L

217°C

Time t

80sec

max. 100sec

Peak Temperature T

P

245°C

max. 260°C

Time t

peak temperature T

20sec

min. 10sec max. 30sec

Ramp-down Rate*

T

3°K / sec

6°K / sec maximum

Time 25°C to Peak temperature

max. 8 min.

0

50

100

150

200

250

T

˚C

S

t

t

P

t

T

p

240 ˚C

217 ˚C

245 ˚C

25 ˚C

L