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MP2269GD 数据表(PDF) 3 Page - Monolithic Power Systems

部件名 MP2269GD
功能描述  3.3V - 30V, 1A, 12uA IQ, Synchronous, Step-Down Converter with External Soft Start and Power Good in 2x3mm QFN Package
PDF  19 Pages
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制造商  MPS [Monolithic Power Systems]
网页  http://www.monolithicpower.com
标志 MPS - Monolithic Power Systems

MP2269GD 数据表(HTML) 3 Page - Monolithic Power Systems

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MP2269 - 30V, 1A, LOW IQ, SYNCHRONOUS STEP-DOWN CONVERTER
MP2269 Rev. 1.0
www.MonolithicPower.com
3
10/11/2016
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2016 MPS. All Rights Reserved.
ABSOLUTE MAXIMUM RATINGS (1)
Supply voltage (VIN)...................... -0.3V to 40V
Switch voltage (VSW) ......-0.3V to VIN (MAX) + 0.3V
BST voltage (VBST) .....................VSW (MAX) + 6.5V
EN voltage (VEN) ............................ -0.3V to 40V
PG voltage..................................... -0.3V to 32V
BIAS voltage.................................. -0.3V to 20V
All other pins.................................... -0.3V to 6V
Continuous power dissipation (TA = +25°C)
(2)
QFN-15 (2mmx3mm) .................................1.7W
Operating junction temperature................ 150°C
Lead temperature .................................... 260°C
Storage temperature.................. -65°C to 150°C
Recommended Operating Conditions
(3)
Supply voltage (VIN)....................... 3.3V to 30V
Operating junction temp (TJ) .... -40°C to +125°C
Thermal Resistance
(4)
θJA
θJC
QFN-15 (2mmx3mm) ............ 70....... 15 ... °C/W
NOTES:
1) Absolute maximum ratings are rated under room temperature
unless otherwise noted. Exceeding these ratings may
damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ(MAX), the junction-to-
ambient thermal resistance θ
JA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-
TA)/ θJA. Exceeding the maximum allowable power dissipation
produces an excessive die temperature, causing the regulator
to go into thermal shutdown. Internal thermal shutdown
circuitry protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.



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