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MP4433 数据表(PDF) 21 Page - Monolithic Power Systems

部件名 MP4433
功能描述  36V, 3A, Low Quiescent Current, Synchronous, Step-Down Converter
PDF  29 Pages
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制造商  MPS [Monolithic Power Systems]
网页  http://www.monolithicpower.com
标志 MPS - Monolithic Power Systems

MP4433 数据表(HTML) 21 Page - Monolithic Power Systems

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MP4433 - 36V, 3A, LOW IQ, SYNCHRONOUS STEP-DOWN CONVERTER
MP4433 Rev. 1.01
www.MonolithicPower.com
21
1/12/2018
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2018 MPS. All Rights Reserved.
BST Refresh
To improve drop out, the MP4433 is designed
to operate at close to 100% duty cycle for as
long as the BST to SW voltage is greater than
2.5V. When the voltage from BST to SW drops
below 2.5V, the HS-FET is turned off using a
UVLO circuit, which forces the LS-FET on to
refresh the charge on the BST capacitor.
Since the supply current sourced from the BST
capacitor is low, the HS-FET can remain on for
more switching cycles than are required to
refresh the capacitor, thus making the effective
duty cycle of the switching regulator high.
The effective duty cycle during dropout of the
regulator is mainly influenced by the voltage
drops across the HS-FET, LS-FET, inductor
resistance, and printed circuit board resistance.
Thermal Shutdown
Thermal shutdown is implemented to prevent
the chip from running away thermally. When the
silicon die temperature exceeds its upper
threshold, the power MOSFETs shut down.
When the temperature drops below its lower
threshold, the chip is enabled again.
Start-Up and Shutdown
If both VIN and EN exceed their appropriate
thresholds, the chip starts up. The reference
block starts first, generating a stable reference
voltage and current, and then the internal
regulator is enabled. The regulator provides a
stable supply for the rest of the circuitries.
While the internal supply rail is up, an internal
timer holds the power MOSFET off for about
50µs to blank the start-up glitches. When the
soft-start block is enabled, it first holds its SS
output low to ensure that the rest of the
circuitries are ready, and then slowly ramps up.
Three events can shut down the chip: VIN low,
EN low, and thermal shutdown. During the
shutdown procedure, the signaling path is
blocked first to avoid any fault triggering. VCOMP
and the internal supply rail are then pulled down.
The floating driver is not subject to this
shutdown command, but its charging path is
disabled.



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