The Smart Timing Choice



The Smart Timing Choice



SiT5021

1-220 MHz High Performance Differential (VC) TCXO

Rev. 1.5

Page 2 of 8

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Parameter and Conditions

Symbol

Min.

Typ.

Max.

Unit

Condition

LVDS, DC and AC Characteristics

Current Consumption

Idd

–

47

55

mA

Excluding Load Termination Current, Vdd = 3.3V or 2.5V

OE Disable Supply Current

I_OE

–

–

35

mA

OE = Low

Differential Output Voltage

VOD

250

350

450

mV

See Figure 2

Output Disable Leakage Current

I_leak

–

–

1

AOE = Low

Standby Current

I_std

–

–

100

A

ST = Low, for all Vdds

VOD Magnitude Change

VOD

–

–

50

mV

See Figure 2

Offset Voltage

VOS

1.125

1.2

1.375

V

See Figure 2

VOS Magnitude Change

VOS

–

–

50

mV

See Figure 2

Rise/Fall Time

Tr, Tf

–

495

600

ps

20% to 80%, see Figure 2

OE Enable/Disable Time

T_oe

–

–

115

ns

f = 212.5 MHz - For other frequencies, T_oe = 100ns + 3 period

RMS Period Jitter

T_jitt

–

1.2

1.7

ps

f = 100 MHz, VDD = 3.3V or 2.5V

–

1.2

1.7

ps

f = 156.25 MHz, VDD = 3.3V or 2.5V

–

1.2

1.7

ps

f = 212.5 MHz, VDD = 3.3V or 2.5V

RMS Phase Jitter (random)

T_phj

–

0.6

0.85

ps

f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz, all

Vdds

Pin Description

Pin

Map

Functionality

1

VC/OE/ST

V Control

Voltage control

Output Enable

H or Open: specified frequency output

L: output is high impedance

Standby

H or Open: specified frequency output

L: Device goes to sleep mode. Supply current reduces to I_std.

2

NC

NA

No Connect; Leave it floating or connect to GND for better heat dissipation

3

GND

Power

VDD Power Supply Ground

4

OUT+

Output

Oscillator output

5

OUT-

Output

Complementary oscillator output

6

VDD

Power

Power supply voltage

Absolute Maximum

Attempted operation outside the absolute maximum ratings may cause permanent damage to the part. Actual performance of

the IC is only guaranteed within the operational specifications, not at absolute maximum ratings.

Parameter

Min.

Max.

Unit

Storage Temperature

-65

150

°C

VDD

-0.5

4

V

Electrostatic Discharge (HBM)

–2000

V

Soldering Temperature (follow standard Pb free soldering guidelines)

–

260

°C

Thermal Consideration

Package

(°C/W)

(°C/W)

7050, 6-pin

142

27

5032, 6-pin

97

20

3225, 6-pin

109

20

Environmental Compliance

Parameter

Condition/Test Method

Mechanical Shock

MIL-STD-883F, Method 2002

Mechanical Vibration

MIL-STD-883F, Method 2007

Temperature Cycle

JESD22, Method A104

Solderability

MIL-STD-883F, Method 2003

Moisture Sensitivity Level

MSL1 @ 260°C

4

3

1

6

GND

VDD

OUT+

5

2

NC

OUT-

VC/OE/ST

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