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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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LSL89K 数据表(PDF) 11 Page - OSRAM GmbH |
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LSL89K 数据表(HTML) 11 Page - OSRAM GmbH |
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11 / 15 page  LS L89K, LO L89K, LY L89K 2005-03-02 11 Empfohlenes Lötpaddesign 8) 9) Seite 15 IR Reflow Löten Recommended Solder Pad 8) 9) page 15 IR Reflow Soldering Empfohlenes Lötpaddesign verwendbar für SmartLED ® und Chipled - Bauform 0603 IR Reflow Löten 8) 9) 10) Seite 15 Recommended Solder Pad useable for SmartLED ® and Chipled - Package 0603 IR Reflow Soldering 8) 9) 10) page 15 Empfohlene Lötpastendicke: 120 µm/ recommended thickness of solder paste: 120 µm OHPY1301 1.45 (0.057) 0.35 (0.014) OHPY0203 2.25 (0.089) 0.65 (0.026) 0.3 (0.012) 0.5 (0.020) |
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