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MP3910 数据表(PDF) 2 Page - Monolithic Power Systems |
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MP3910 数据表(HTML) 2 Page - Monolithic Power Systems |
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2 / 23 page ![]() MP3910 –PEAK CURRENT MODE BOOST CONTROLLER MP3910 Rev. 1.11 www.MonolithicPower.com 2 11/6/2014 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2014 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking MP3910GK MSOP10 M3910 * For Tape & Reel, add suffix –Z (e.g. MP3910GK–Z); PACKAGE REFERENCE COMP GND RT 1 2 3 FB 4 7 8 9 10 VCC GATE EN/SYNC 5 6 SS VIN TOP VIEW ISENSE ABSOLUTE MAXIMUM RATINGS (2) VIN to GND.....................................-0.3V to 40V VCC, GATE to GND.......................–0.3V to 15V All Other Pins...................................–0.3V to 6V EN Pin Sink Current.............................. 0.5mA(6) Continuous Power Dissipation (TA = +25°C) (3) ........................................................... 0.83W Maximum Operating Frequency............. 500kHz Storage Temperature............... -55°C to +150°C Junction Temperature...............................150°C Lead Temperature ....................................260°C Recommended Operating Conditions (4) Supply Voltage VIN ..............................7V to 35V Supply Voltage with VIN and VCC connected ......................................................5V to 13V EN Pin Sink Current.................. 0mA to 0.4mA(5) Operating Junction Temp. (TJ). -40°C to +125°C Thermal Resistance (5) θJA θJC MSOP10 ................................ 150 ..... 65... °C/W Notes: 2) Exceeding these ratings may damage the device. 3) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 4) The device is not guaranteed to function outside of its operating conditions. 5) Measured on JESD51-7, 4-layer PCB. 6) Refer to “Enable/SYNC Control” section. |
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