MP6302 datasheet(2/12 Pages) MPS

2 / 12 page

MP6302 – ENERGY STORAGE AND RELEASE CONTROL IC

MP6302 Rev. 1.02

www.MonolithicPower.com

7/17/2015

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Free Air Temperature (TA)

MP6302DD

QFN10 (2x3mm)

ABC

-40

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP6302DD–Z);

PACKAGE REFERENCE

TOP VIEW

STRG

VMAX

VIN

FB2

PGS

PGIN

FB1

GND

BST

QFN10 (2x3mm)

ABSOLUTE MAXIMUM RATINGS (1)

VIN ................................................ -0.3V to 22V

VBST................................................ -0.3V to 40V

VBST-VIN………………………………-0.3V to 25V

VMAX ............................................... -0.3V to 42V

VMAX-VIN………………………….......-0.3V to 25V

VSTRG.............................................. -0.3V to 32V

VSTRG-VIN……………………………..-0.3V to 25V

VPG, VGASP ...................................... -0.3V to 22V

All Other Pins................................ -0.3V to 6.5V

Junction Temperature.............................. 150

°C

Lead Temperature ................................... 260

°C

Continuous Power Dissipation (TA = +25°C)

(2)

..................................................................1.2W

Junction Temperature.............................. 150

°C

Recommended Operating Conditions (3)

Supply Voltage VIN .......................... 4.5V to 18V

Storage Voltage VSTRG .....VIN to 2xVIN(32V max)

Maximum Junction Temp (TJ) ................ +125°C

Thermal Resistance (4)

θJA

θJC

QFN10 (2x3mm) .................... 70 ...... 15...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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