MP8757GL datasheet(3/21 Pages) MPS

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MP8757–18V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER

MP8757 Rev. 1.0

www.MonolithicPower.com

5/1/2018

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage VIN ....................................... 24V

VSW...............................................-0.3V to 24.3V

VSW (30ns)..........................................-3V to 28V

VSW (5ns)............................................-6V to 28V

VBST ................................................... VSW + 5.5V

VEN ............................................................... 12V

Enable Current IEN (2)................................ 2.5mA

All Other Pins ..............................

–0.3V to +5.5V

Continuous Power Dissipation (TA=+25C)

(3)

QFN21 ..................................................... 2.5W

Junction Temperature ...............................150

C

Lead Temperature ....................................260

C

Storage Temperature............... -65

C to +150C

Recommended Operating Conditions

(4)

Supply Voltage VIN ..............................5V to 18V

Output Voltage VOUT....................0.604V to 5.5V

Enable Current IEN....................................... 1mA

Operating Junction Temp. (TJ). -40°C to +125°C

Thermal Resistance

(5)

θJA

θJC

QFN-21 (3mmx4mm) ..............50 ...... 12 ...

C/W

Notes:

1) Exceeding these ratings may damage the device.

2) Refer to Page 13 of Configuring the EN Control.

3) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX),

the junction-to-

mbient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on JESD51-7, 4-layer PCB.

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