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MP5505GL 数据表(PDF) 2 Page - Monolithic Power Systems |
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MP5505GL 数据表(HTML) 2 Page - Monolithic Power Systems |
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2 / 15 page ![]() MP5505 – ENERGY STORAGE AND MANAGEMENT UNIT MP5505 Rev. 1.01 www.MonolithicPower.com 2 1/12/2015 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2015 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking MP5505GL QFN20L (3mmx4mm) MP5505 * For Tape & Reel, add suffix –Z (e.g. MP5505GL–Z); PACKAGE REFERENCE TOP VIEW 1 2 3 4 5 6 7 17 16 15 14 13 12 11 8 9 10 20 19 18 DVDT TPOR ILIM PGIN PGS EN ENCH ICH FBS FBB AGND NC CST BST VIN VB VBO PGND SW STRG QFN20L (3mmx4mm) ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage VIN ......................................8.0V VSTRG.............................................. -0.3V to 35V VSW .....................................-0.3V to VSTRG+0.3V VBST ....................................-0.3V to VSTRG+6.5V VCST ............................................... -0.3V to 40V All Other Pins.............................. –0.3V to 6.5 V Continuous Power Dissipation (TA = +25°C) (2) ............................................................2.6W Junction Temperature.............................. 150°C Lead Temperature ................................... 260°C Operating Temperature............. –40°C to +85°C Recommended Operating Conditions (3) Supply Voltage VIN ............................ 2.7V to 7V Bus Voltage VB ................................. 2.7V to 6V Storage Voltage VSTRG ....................... VIN to 30V Operating Junction Temp. (TJ). -40°C to +125°C Thermal Resistance (4) θJA θJC QFN20 (3mmx4mm)............... 48 ...... 10... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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