www.vishay.com

6

Document Number 81075

Rev. 3, 06-Jun-03

VISHAY

TSML3710

Vishay Semiconductors

Temperature - Time Profile

Drypack

Devices are packed in moisture barrier bags (MBB) to

prevent the products from moisture absorption during

transportation and storage. Each bag contains a des-

iccant.

Floor Life

Floor life (time between soldering and removing from

MBB) must not exceed the time indicated in

J-STD-020.

TSML 3710 is released for:

Moisture Sensitivity Level 2, according to JEDEC,

J-STD-020

Floor Life: 1 year

Conditions: Tamb < 30°C, RH < 60%

Drying

In case of moisture absorption devices should be

baked before soldering. Conditions see J-STD-020 or

Label.

Devices taped on reel dry using recommended condi-

tions 192 h @ 40°C (+ 5°C), RH < 5%

Figure 11. Infrared Reflow Soldering Optodevices (SMD Package)

max. 160 C

full line

: typical

dotted line : process limits

Time ( s )

Lead Temperature

90s-120s

300

250

200

150

100

50

0

0

50

100

150

200

250

max. 240 C

ca. 230 C

10 s

215 C

max 40 s

2 K/s - 4 K/s

94 8625

°

°

°

°

Figure 12. Blister Tape

Figure 13. Tape Dimensions in mm for PLCC-2

Adhesive Tape

Component Cavity

Blister Tape

94 8670

1.85

1.65

4.0

3.6

3.6

3.4

2.05

1.95

1.6

1.4

4.1

3.9

4.1

3.9

5.75

5.25

8.3

7.7

3.5

3.1

2.2

2.0

0.25

94 8668