MP8763GLE datasheet(2/24 Pages) MPS

2 / 24 page

MP8763 — 12A, 18V, SYNCHRONOUS STEP-DOWN CONVERTER

MP8763 Rev. 1.3

www.MonolithicPower.com

6/21/2016

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

MP8763GL*

QFN-13(3mm×4mm)

MP8763

MP8763GLE**

QFN-16(3mm×4mm)

MP8763E

* For Tape & Reel, add suffix –Z (e.g. MP8763GL–Z)

** For Tape & Reel, add suffix –Z (e.g. MP8763GLE–Z)

Note: The 16-pin QFN package is preferred and recommended for new designs

PACKAGE REFERENCE

TOP VIEW

PGND

BST

VCC

AGND

FREQ

PGND

TOP VIEW

13-Pin QFN (3x4mm)

Not recommended for new design

16-Pin QFN (3x4mm)

Recommended for new design

ABSOLUTE MAXIMUM RATINGS

(1)

Supply Voltage VIN .......................................21V

VSW ......................................−0.3V to VIN + 0.3V

VSW (30ns) .................................−3V to VIN + 3V

VBST .....................................................VSW + 6V

Enable Current IEN

(2 ...................................................... 2.5mA

All Other Pins................................ –0.3V to +6V

Continuous Power Dissipation (TA=+25°)

(3)

QFN3×4.....................................................2.7W

Junction Temperature .............................. 150°C

Lead Temperature ................................... 260°C

Storage Temperature.............. −65°C to +150°C

Recommended Operating Conditions

(4)

Supply Voltage VIN .......................... 4.5V to 18V

Output Voltage VOUT.................... 0.611V to 13V

IEN ................................................ 0mA to 1mA

Operating Junction Temp. (TJ).−40°C to +125°C

Layout

Recommendation

for

Best

Performance

Thermal Resistance

(5)

θJA

θJC

QFN (3mm×4mm) .................. 46 ....... 9.... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) Refer to the section “Configuring the EN Control”.

3) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX),

the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on JESD51-7, 4-layer PCB.

MP8763GLE 数据表(PDF) 2 Page - Monolithic Power Systems

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